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Although the circular economy is widely regarded as an essential strategy for firms, the present understanding of the drivers and outcomes of circular economy implementation is underdeveloped. In this paper, the authors draw on the natural resource-based view and information processing theory to explore how an environmental orientation and digital supply chain platforms promote circular economy implementation, and increase the impact of circular economy implementation on financial performance.

The authors surveyed 249 Chinese firms and used hierarchical regression analysis to test hypotheses.

The empirical results reveal that three primary modes of circular economy implementation—reinvent and rethink (INV), restore, reduce and avoid (RRA), and recirculate (REC)—are all driven by environmental orientation and digital supply chain platforms. More interestingly, digital supply chain platforms have an inverted U-shaped moderating effect on the relationships between environmental orientation and INV and between environmental orientation and RRA. Most importantly, INV and RRA are positively related to financial performance, whereas REC does not have a significant relationship with financial performance.

The authors contribute to the literature on the circular economy by revealing new drivers and outcomes of different modes of its implementation. Additionally, the findings have implications for how firms should frame their circular economy initiatives in the context of the digital revolution.

This paper aims to study the effect of current density of hydrogen charging on the semiconductor properties and pitting initiation of 2205 duplex stainless steel (DSS) passivation film.

In this work, the 2205 DSS is pre-hydrogenated and passivated. Then, the passivation film is tested by electrochemical impedance method, Mott–Schottky curve method and dynamic potential scanning method. The influences of hydrogen on the properties of the passivation film and the corrosion behavior of the matrix were studied by analyzing the curves obtained in the electrochemical test. The surface of the passivation film after pre-hydrogenation and anodic polarization was observed by using the ultra-depth three-dimensional microscopy and the scanning electron microscope. The integrity, density and corrosion morphology of the passivation film were studied and discussed.

With the increase of the hydrogen current density, the growth of the passivation film is hindered, the concentrations of donor and acceptor in the film are increased, the conductivity of the passivation film increases. In the anodic polarization, the dimensional passive current density increases with the increase of the hydrogen current density, and the pitting potential is reversed, the more likely the sample is pitting. In general, hydrogen hinders the formation of the passive film on duplex stainless steel, which increases the concentration of point defects in the passive film. Finally, the passive film is easy to crack and pitting.

The performance of passive film is an important condition to influence the corrosion behavior of stainless steel. However, little research has been done on the effects of hydrogen on the electrochemistry and pitting sensitivity of 2205 DSS passivation films. The effect of hydrogen on semiconductor properties and pitting initiation of 2205 DSS passivation film is needed to be investigated.

This study aims to investigate the effect of coatings prepared by the addition of copper-aluminum alloy powder on the corrosion behavior of 90/10 copper-nickel alloy.

Coatings of copper-aluminum alloy powder at different contents (Wt.% = 50%, 60%, 70% and 80%) were prepared by the high-temperature heat treatment process. The microstructure and component of the coatings were characterized by scanning electron microscope, X-ray diffraction, energy dispersive spectrometer and X-ray photoelectron spectroscopy. The electrochemical properties of the coating were explored by electrochemical impedance spectroscopy.

The results show that the aluminized layer was successfully constructed on the surface of 90/10 copper-nickel alloy, the composition of the coating was composed of copper-aluminum phase and aluminum-nickel phase, the existence of the aluminum-nickel phase was formed by the diffusion of Ni elements within the substrate and because of the diffusion, the Al-Ni phase was distributed in the middle and bottom of the coating more. The Al-Ni phase is considered to be the enhanced phase for corrosion resistance. When the copper-aluminum alloy powder content is 70 Wt.%, the corrosion resistance is the best.

The enhancement of corrosion resistance of 90/10 copper-nickel alloy by the copper-aluminum alloy powder was revealed, the composition of the aluminized layer and the mechanism of corrosion resistance were discussed.

This study aims to investigate the effect of changes in iron content in 70/30 copper–nickel alloy on the corrosion process.

70Copper–30Nickel-xFe-1Mn (x = 0.4,0.6,0.8,1.0 Wt.%) alloy were prepared by the high frequency induction melting furnace. The scanning electron microscope, X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS) and electrochemical impedance spectroscopy were used to analyze the morphology and component of the corrosion product film.

The results show that the corrosion resistance of 70/30 copper–nickel alloy added with 1.0%Fe is the best, and the film is divided into inner dense Cu2O composite film and outer hydration loose layer; XRD showed that after adding 1.0% Fe, the content of Cu2(OH)3Cl in the corrosion product film was significantly reduced, while the content of Cu2O remained unchanged; XPS showed that nickel accumulates in the inner layer of corrosion product film; the stage growth mode of the film, the role of nickel in it and the enrichment mechanism of iron in the inner film were summarized and discussed.

The changes in the composition and structure of the corrosion product film caused by the iron content are revealed, and the mechanism of the difference in corrosion resistance is discussed.